底部填充工艺对点胶机有什么性能要求吗?
　　What are the performance requirements of the dispensing machine for the bottom filling process?
　　底部填充工艺就是将环氧树脂胶水点涂在倒装晶片边缘，通过“毛细管效应”，胶水被吸往元件的对侧完成底部充填过程，然后在加热的情况下胶水固化。
　　The bottom filling process is to apply the epoxy resin glue point on the edge of the flip chip, through the "capillary effect", the glue is sucked to the opposite side of the component to complete the bottom filling process, and then the glue solidifies when heated.
　　底部填充工艺对点胶机有什么性能要求吗?
　　What are the performance requirements of the dispensing machine for the bottom filling process?
　　1.底部填充要对胶水进行加热，要保持胶水的温度，因此我们的点胶机设备必须要具有热管理功能。
　　1. For bottom filling, the glue shall be heated first, and the glue temperature shall be maintained. Therefore, our dispensing machine equipment must have thermal management function.

　　2.底部填充工艺需要对元器件进行加热，这样可以加快胶水的毛细流速，并为正常固化提供有利的保障。
　　2. The bottom filling process needs to heat the components, which can speed up the capillary velocity of glue and provide favorable guarantee for normal curing.
　　3.底部填充工艺对点胶的精度要求也很高，尤其是RF屏蔽罩已经组装到位时，需要要通过上面孔来进行点胶操作。
　　3. The bottom filling process also requires high dispensing accuracy, especially when the RF shield has been assembled in place, the dispensing operation needs to be carried out through the upper hole.
　　综上所述，以上就是底部填充工艺对点胶机的性能方面的要求，我们大家在对底部填充工艺进行点胶的过程中要格外注意，希望对大家有所帮助!
　　To sum up, the above is the requirements of the bottom filling process on the performance of the dispenser. We should pay special attention to the bottom filling process in the process of dispensing, hoping to help you!